RF & Microwave Packages

Ceramic and glass-to-metal hermetic packages

TO Headers and Packages

Standard and customized designs for your application

Optoelectronic Packages

Optical and fiber optic hermetic packages available in small footprints and for harsh environments

Power Discrete Packages

AlN High Temperature Co-fired Ceramic (HTCC) packaging technology for high power densities

Standard, custom, or simply hard to find,

EPI is ready to help with your microelectronic package needs.

Hermetic Microelectronic Packages

Electronic Products (EPI) is a powder-to-package, fully-integrated HTCC technical ceramics package and glass-to-metal seal manufacturer for microelectronic applications. EPI is fully-equipped and vertically integrated in its 26,000 square foot, Newburyport, MA, ISO 9001:2015-registered manufacturing facility.

The EPI goal is to deliver turnkey, custom-designed and standard microelectronic packages for various industries and applications. In military and aerospace applications, EPI manufactures microelectronic hermetic packages for applications including communication systems, guidance/navigation/radar, optics, and more. Our microelectronic packages are also common in industrial applications with harsh environments including oil and gas instrumentation, process controls, and medical diagnostic equipment.

Partner with EPI to design a hermetic package solutions for harsh environments. Our broad range of sealing methods, plating materials, and proprietary processes allow for a combination of specialized hermetic feedthroughs for challenging environments.

TECHNICAL ADVANTAGES

  • High-Temperature Co-Fired Ceramic (HTCC) multilayer AIN circuits fired at +1800°C are fully dense hermetic structures that provide low Coefficient of Thermal Expansion (CTE) and 170 W/mK Thermal Conductivity (TC). Ideally suited for high power electronics.
  • Various ceramic materials to find the right material for the application include:
    • Aluminas (AL2O3)
    • Zirconia Toughened Alumina (ZTA)
    • Aluminum Nitride (AIN)
  • Matched and compression-based glass-to-metal seal capabilities in standard and customized packages in nickel, copper, silver, and gold.
  • Hybrid hermetic packages combining our technologies to create unique solutions to solve challenging conditions.

CAPABILITIES

  • Powder-to-package multilayer ceramic process capabilities up to 3” x 3” and up to 10+ layers.
  • Hermetic hybrid packages that combine ceramic and glass-to-metal technologies in a single design.
  • Screen printing in Tungsten, Molybdenum/ Manganese, and dielectrics.
  • In-house tooling, plating, clean room processing, and inspection equipment to meet all quality requirements.
  • Custom designs in various production volumes
  • Microelectronic hermetic packages for high current and voltage ratings
  • Small footprint, standard and custom microelectronic packages for optical, LEDs, sensing elements, and those with demanding focal plane arrays; packages available with clear flat or convex lenses.
  • Standard and custom RF/microwave hermetic packages for military, aerospace, and satellite communications.

Hermetic Package Types

RF & Microwave Packages

AIN SMD.22 hermetic power package U4 layout

RF and microwave hermetic packages for a variety of power and signal applications.

Optoelectronic Packages

Black alumina IR detector hermetic package

Optoelectronic and fiber optic packages in various standard and customized footprints

Power Discrete Packages

SMD.5 hermetic diode package using HTCC ceramic technology

Customized HTCC hermetic ceramic power discrete packages for harsh environments and high power densities.

TO Packages & Headers

TO-18 hermetic header with 3+1 configuration

Standard and custom TO headers and packages to meet and exceed customer specifications.

Unsure Where to Start?

Let’s Connect


Our team takes pride on the ability to provide technical support across a variety of hermetic applications. Tell us about your hermetic package requirements and we’ll work to find a solution together.  We’re ready for the challenge.